Disco Corporation Equipment For Qrindinq Of
- صفحه اصلی
- Disco Corporation Equipment For Qrindinq Of
DISCO holds leading market share in the production of wafer grinders, grinding wheels, wafer dicing saws, laser saws, and surface planarization. These businesses allowed …
WhatsApp: +86 18221755073
DISCO holds leading market share in the production of wafer grinders, grinding wheels, wafer dicing saws, laser saws, and surface planarization. These businesses allowed DISCO to generate nearly $2B of revenue in 2021.
WhatsApp: +86 18221755073
Automatic Grinder (Semi-Automatic Equipment for Grinding Wheels) With this type of equipment, loading/unloading of the workpiece and cleaning are performed manually. A thickness measurement function within the machine can be additionally installed upon request. please contact DISCO CORPORATION.
WhatsApp: +86 18221755073
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information …
WhatsApp: +86 18221755073
DIS100 is a unit that picks up die from the wafer after singulation and measures the die thickness, chipping, backside surface roughness, and die strength using a fully automatic process. Efficient and highly accurate measurement is achieved by auto-mating all of …
WhatsApp: +86 18221755073
View DISCO grinder and polisher available for DGS. Buy high quality grinding/polishing equipment.
WhatsApp: +86 18221755073
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding.
WhatsApp: +86 18221755073
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of …
WhatsApp: +86 18221755073
DISCO's precision processing technologies have been improved through processing a wide range of materials. If you require solutions for your processing issues, please contact DISCO Corporation. Inquiries
WhatsApp: +86 18221755073
DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
WhatsApp: +86 18221755073
View DISCO grinder and polisher available for DGS. Buy high quality grinding/polishing equipment.
WhatsApp: +86 18221755073
Automatic Grinder (Semi-Automatic Equipment for Grinding Wheels) With this type of equipment, loading/unloading of the workpiece and cleaning are performed manually. A thickness …
WhatsApp: +86 18221755073
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers ...
WhatsApp: +86 18221755073
Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO's precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.
WhatsApp: +86 18221755073
DISCO Corporation Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.
WhatsApp: +86 18221755073
DISCO's precision processing technologies have been improved through processing a wide range of materials. If you require solutions for your processing issues, please contact DISCO …
WhatsApp: +86 18221755073
DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while …
WhatsApp: +86 18221755073
DISCO Corporation Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing …
WhatsApp: +86 18221755073
DIS100 is a unit that picks up die from the wafer after singulation and measures the die thickness, chipping, backside surface roughness, and die strength using a fully automatic process. …
WhatsApp: +86 18221755073چه بخواهید با ما کار کنید و چه علاقه مند به کسب اطلاعات بیشتر در مورد محصولات ما هستید، مایلیم از شما بشنویم.